Umshini Wokusika Intambo Yedayimane we-SiC | Isafire | I-quartz | Ingilazi
Umdwebo onemininingwane yomshini wokusika i-Diamond Wire
Uhlolojikelele Lomshini Wokusika Intambo Yedayimane
I-Diamond Wire Single-Line Cutting System iyisisombululo esithuthukisiwe esiklanyelwe ukusika ama-substrates aqinile kakhulu futhi aphukayo. Isebenzisa ucingo oluboshwe ngedayimane njengendawo yokusika, okokusebenza kuletha isivinini esikhulu, umonakalo omncane, nokusebenza ngendlela eyongayo. Ilungele ukusetshenziswa okufana namawafa esafire, ama-SiC boules, amapuleti equartz, izitsha zobumba, ingilazi ebonakalayo, izinti ze-silicon, namatshe ayigugu.
Uma kuqhathaniswa namasaha omdabu noma izintambo ezilumayo, lobu buchwepheshe buhlinzeka ngokunemba okuphezulu kobukhulu, ukulahleka kwe-kerf ephansi, nobuqotho obungaphezulu obuthuthukisiwe. Isetshenziswa kabanzi kuwo wonke ama-semiconductors, ama-photovoltaics, amadivaysi e-LED, okokubona, nokucubungula amatshe okunembayo, futhi ayisekeli nje kuphela ukusika umugqa oqondile kodwa futhi nokusikwa okukhethekile kwezinto ezinomumo omkhulu kakhulu noma ongajwayelekile.
Isimiso sokusebenza
Umshini usebenza ngokushayela aintambo yedayimane ngesivinini esiphezulu somugqa (kufika ku-1500 m/min). Izinhlayiya ezilumayo ezishumekwe ocingweni zisusa izinto ngokugaya okuncane, kuyilapho amasistimu asizayo eqinisekisa ukwethembeka nokunemba:
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Ukondla okunembayo:Ukunyakaza okushayelwa yi-Servo okunama-linear guide rails kuzuza ukusika okuzinzile nokuma kwezinga le-micron.
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Ukupholisa nokuhlanza:Ukugezwa kwamanzi okuqhubekayo kunciphisa amandla okushisa, kuvimbela imifantu emincane, futhi kususe udoti ngempumelelo.
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Ukulawula Ukuqina Kwezintambo:Ukulungiswa okuzenzakalelayo kugcina amandla angashintshi ocingweni (±0.5 N), kunciphisa ukuchezuka nokuphuka.
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Amamojula Angazikhethela:Izigaba ezijikelezayo zama-engeli noma ama-cylindrical workpieces, amasistimu ane-high-tension wezinto eziqinile, nokuqondanisa okubonakalayo kwejometri eyinkimbinkimbi.
Imininingwane Yezobuchwepheshe
| Into | Ipharamitha | Into | Ipharamitha |
|---|---|---|---|
| Usayizi Womsebenzi Omkhulu | 600×500 mm | Isivinini sokugijima | 1500 m/min |
| I-Angle Yokushwibeka | 0~±12.5° | Ukusheshisa | 5 m/s² |
| Swing Frequency | 6-30 | Isivinini sokusika | <3 amahora (6-intshi SiC) |
| Lift Stroke | 650 mm | Ukunemba | <3 μm (6-intshi SiC) |
| I-Sliding Stroke | ≤500 mm | Ububanzi Bentambo | φ0.12 ~ φ0.45 mm |
| Lift Speed | 0~9.99 mm/min | Ukusetshenziswa kwamandla | 44.4 kW |
| Isivinini Sokuhamba Esisheshayo | 200 mm/min | Usayizi Womshini | 2680×1500×2150 mm |
| Ukushuba Okungapheli | 15.0N~130.0N | Isisindo | 3600 kg |
| Ukunemba Kwengcindezi | ±0.5 N | Umsindo | ≤75 dB(A) |
| Ibanga elimaphakathi lamasondo omhlahlandlela | 680~825 mm | Ukuhlinzekwa Kwegesi | > 0.5 MPa |
| I-Coolant Tank | 30 L | Ulayini Wamandla | 4×16+1×10 mm² |
| I-Mortar Motor | 0.2 kW | - | - |
Izinzuzo Eziyinhloko
Ukusebenza Okuphezulu Ne-Kerf Encishisiwe
Isivinini socingo sifika ku-1500 m/min ukuze siphume ngokushesha.
Ububanzi be-kerf obuncane kwehlisa ukulahlekelwa kwezinto ngokufika ku-30%, okwandisa isivuno.
Iyavumelana nezimo futhi isebenziseka kalula
Isikrini sokuthinta se-HMI esinokugcinwa kweresiphi.
Isekela ukusebenza okuqondile, ijika, kanye neziqephu eziningi zokuvumelanisa.
Imisebenzi Enwebekayo
Isiteji esijikelezayo sokusikeka kwe-bevel nesiyingi.
Amamojula anomfutho ophezulu we-SiC ezinzile nokusika kwesafire.
Amathuluzi okuqondanisa okubonakalayo ezingxenye ezingajwayelekile.
Idizayini Eqinile Yemishini
Uhlaka olusindayo lumelana nokudlidliza futhi luqinisekisa ukunemba kwesikhathi eside.
Izingxenye zokugqoka ezingukhiye zisebenzisa i-ceramic noma i-tungsten carbide coating for > amahora angu-5000 wempilo yesevisi.
Izimboni Zokusebenza
Ama-semiconductors:Ukusika ingot ye-SiC ephumelelayo ngokulahleka kwe-kerf <100 μm.
I-LED & Optics:Ukucutshungulwa kwe-wafer yesafire okunembe okuphezulu kwezithombe nama-electronics.
Imboni yeSolar:Ukunqampuna kwenduku ye-Silicon nokusikwa kwe-wafer kumaseli e-PV.
I-Optical & Jewelry:Ukusikwa okuhle kwe-quartz namatshe ayigugu anokuqedwa kwe-Ra <0.5 μm.
I-Aerospace & Ceramics:Icubungula i-AlN, i-zirconia, nezitsha zobumba ezithuthukisiwe zezinhlelo zokusebenza ezisezingeni eliphezulu.
I-FAQ Yezingilazi Zequartz
Q1: Yiziphi izinto ezingasetshenziswa umshini?
A1:Ilungiselelwe i-SiC, isafire, i-quartz, i-silicon, i-ceramics, ingilazi ebonakalayo, namatshe ayigugu.
Q2: Inembe kangakanani inqubo yokusika?
A2:Kumawafa e-SiC angu-6 intshi, ukunemba kogqinsi kungafinyelela ku-<3 μm, ngekhwalithi ephezulu kakhulu.
Q3: Kungani ukusika kwentambo yedayimane kudlula izindlela zendabuko?
A3:Inikeza isivinini esisheshayo, ukulahlekelwa kwe-kerf encishisiwe, ukulimala okuncane kokushisa, kanye nemiphetho ebushelelezi uma kuqhathaniswa nezintambo ezilimazayo noma ukusika i-laser.
I-Q4: Ingakwazi ukucubungula ama-cylindrical noma amajamo angajwayelekile?
A4:Yebo. Ngesiteji sokujikeleza esingazikhethela sona, singakwazi ukusika isiyingi, i-bevel, ne-engeli ezindongeni noma kumaphrofayela akhethekile.
I-Q5: I-wire tension ilawulwa kanjani?
A5:Uhlelo lusebenzisa ukulungiswa kwe-othomathikhi yokuvala loop ngokunemba okungu-±0.5 N ukuvimbela ukuphuka kwentambo nokuqinisekisa ukusika okuzinzile.
Q6: Yiziphi izimboni ezisebenzisa lobu buchwepheshe kakhulu?
A6:Ukukhiqizwa kwe-semiconductor, amandla elanga, i-LED & photonics, ukwakhiwa kwengxenye ye-optical, ubucwebe, nezitsha zobumba ze-aerospace.
Mayelana NATHI
I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ukukhiqiza, nokudayiswa kwengilazi ekhethekile yokubona nezinto ezintsha zekristalu. Imikhiqizo yethu isebenza ngogesi obonakalayo, ugesi wabathengi, kanye nezempi. Sinikezela ngezinto ezibonakalayo ze-Sapphire, izembozo zamalensi omakhalekhukhwini, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, namawafa ekristalu e-semiconductor. Ngobungcweti abanamakhono nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungajwayelekile, sihlose ukuba yibhizinisi elihamba phambili le-optoelectronic materials high-tech.
