Umshini Wokusika Intambo Yedayimane we-SiC | I-Sapphire | I-Quartz | Ingilazi

Incazelo emfushane:

Uhlelo Lokusika Umugqa Owodwa We-Diamond Wire luyisisombululo sokucubungula esithuthukisiwe esenzelwe ukusika izisekelo eziqinile kakhulu neziphuka kalula. Sisebenzisa ucingo olumbozwe ngedayimane njengendlela yokusika, imishini iletha isivinini esikhulu, umonakalo omncane, kanye nokusebenza okungabizi kakhulu. Lulungele ukusetshenziswa okufana nama-wafer e-sapphire, ama-boules e-SiC, amapuleti e-quartz, i-ceramics, ingilazi ebonakalayo, izinduku ze-silicon, namatshe ayigugu.


Izici

Ukubuka Konke Komshini Wokusika Izintambo Zedayimane

Uhlelo Lokusika Umugqa Owodwa We-Diamond Wire luyisisombululo sokucubungula esithuthukisiwe esenzelwe ukusika izisekelo eziqinile kakhulu neziphuka kalula. Sisebenzisa ucingo olumbozwe ngedayimane njengendlela yokusika, imishini iletha isivinini esikhulu, umonakalo omncane, kanye nokusebenza okungabizi kakhulu. Lulungele ukusetshenziswa okufana nama-wafer e-sapphire, ama-boules e-SiC, amapuleti e-quartz, i-ceramics, ingilazi ebonakalayo, izinduku ze-silicon, namatshe ayigugu.

Uma kuqhathaniswa nama-saw blades endabuko noma izintambo ezihudulayo, lobu buchwepheshe buhlinzeka ngokunemba okuphezulu, ukulahleka kwe-kerf ephansi, kanye nokuqina kobuso okuthuthukisiwe. Busetshenziswa kabanzi kuma-semiconductors, ama-photovoltaics, amadivayisi e-LED, ama-optics, kanye nokucubungula amatshe ngokunemba, futhi abusekeli nje kuphela ukusika okuqondile kodwa futhi nokusika okukhethekile kwezinto ezinkulu noma ezimile ngendlela engajwayelekile.

umshini_wokusika_umugqa_owodwa_we-sapphire_quartz_ceramic_material_

Isimiso Sokusebenza

Umshini usebenza ngokushayela i-ucingo lwedayimane ngesivinini esiphezulu kakhulu (kufika ku-1500 m/min)Izinhlayiya ezihudulayo ezifakwe ocingweni zisusa izinto ngokusebenzisa ukugaya okuncane, kuyilapho izinhlelo ezisizayo ziqinisekisa ukuthembeka nokunemba:

  • Ukondla Okunembile:Ukunyakaza okuqhutshwa yi-servo okunezinqola zokuqondisa eziqondile kufeza ukusika okuzinzile kanye nokubekwa ezingeni le-micron.

  • Ukupholisa Nokuhlanza:Ukuhlanza njalo okusekelwe emanzini kunciphisa ithonya lokushisa, kuvimbela imifantu emincane, futhi kususa udoti ngempumelelo.

  • Ukulawulwa Kokucindezeleka Kwezintambo:Ukulungiswa okuzenzakalelayo kugcina amandla angaguquki entanjeni (± 0.5 N), kunciphisa ukuphambuka nokuphuka.

  • Amamojula Okuzikhethela:Izigaba ezijikelezayo zezinto zokusebenza ezine-engile noma eziyisilinda, izinhlelo zokucindezela okuphezulu kwezinto eziqinile, kanye nokuqondanisa okubonakalayo kwejometri eziyinkimbinkimbi.

  • Umshini Wokusika Intambo Yedayimane we-SiC Sapphire Quartz Glass 1
  • Umshini Wokusika Intambo Yedayimane we-SiC Sapphire Quartz Glass 2

Imininingwane Yobuchwepheshe

Into Ipharamitha Into Ipharamitha
Usayizi Omkhulu Womsebenzi 600×500 mm Isivinini Sokugijima 1500 m/min
I-engeli yokushintshashintsha 0~±12.5° Ukusheshisa 5 m/s²
Imvamisa Yokujika 6~30 Isivinini Sokusika <3 amahora (6-intshi SiC)
Ukushaya Kwesitulo Sokuphakamisa 650 mm Ukunemba <3 μm (6-intshi SiC)
I-Stroke Eshelelayo ≤500 mm Ububanzi bentambo φ0.12~φ0.45 mm
Isivinini Sokuphakamisa 0~9.99 mm/min Ukusetshenziswa Kwamandla 44.4 kW
Isivinini Sokuhamba Esisheshayo 200 mm/min Usayizi Womshini 2680×1500×2150 mm
Ukucindezeleka Okuqhubekayo 15.0N~130.0N Isisindo 3600 kg
Ukunemba Kokucindezeleka ±0.5 N Umsindo ≤75 dB(A)
Ibanga Eliphakathi Lamasondo Omhlahlandlela 680~825 mm Ukunikezwa Kwegesi >0.5 MPa
Ithangi Lokupholisa 30 L Umugqa Kagesi 4×16+1×10 mm²
Injini Yodaka 0.2 kW

Izinzuzo Eziyinhloko

Ukusebenza Kahle Kakhulu kanye ne-Kerf Encishisiwe

Isivinini sentambo sifinyelela ku-1500 m/min ukuze kube nomphumela osheshayo.

Ububanzi be-kerf obuncane bunciphisa ukulahleka kwezinto ezibonakalayo ngamaphesenti angama-30, okwandisa isivuno.

Iyaguquguquka futhi isebenziseka kalula

I-HMI yesikrini sokuthinta enesitoreji seresiphi.

Isekela imisebenzi eqondile, egobile, kanye nesebenza ngokuvumelanisa izingcezu eziningi.

Imisebenzi Enwebekayo

Isigaba sokuzungeza sokusika kwe-bevel kanye nesiyingi.

Amamojula anomfutho ophezulu wokusika i-SiC eqinile kanye ne-sapphire.

Amathuluzi okuqondanisa okubonakalayo ezingxenyeni ezingezona ezejwayelekile.

Umklamo Wemishini Ohlala Njalo

Uhlaka oluqinile lumelana nokudlidliza futhi luqinisekisa ukunemba kwesikhathi eside.

Izingxenye ezigugile eziyinhloko zisebenzisa izembozo ze-ceramic noma ze-tungsten carbide isikhathi esingaphezu kwamahora angu-5000.

Umshini Wokusika Intambo Yedayimane we-SiC Sapphire Quartz Glass 3

Izimboni Zokusebenza

Ama-semiconductor:Ukusika i-SiC ingot okusebenzayo okunokulahleka kwe-kerf okungaphansi kuka-100 μm.

I-LED kanye ne-Optics:Ukucubungula i-wafer ye-sapphire enembile kakhulu ye-photonics kanye ne-electronics.

Imboni Yelanga:Ukusikwa kwenduku ye-silicon kanye nokusikwa kwe-wafer kwamaseli e-PV.

Optical & Ubucwebe:Ukusikwa kahle kwe-quartz namatshe ayigugu ane-Ra <0.5 μm finish.

Izindiza kanye ne-Ceramics:Ukucubungula i-AlN, i-zirconia, kanye ne-ceramics ezithuthukisiwe ukuze kusetshenziswe amazinga okushisa aphezulu.

Umshini Wokusika Intambo Yedayimane we-SiC Sapphire Quartz Glass 4

Imibuzo Evame Ukubuzwa Ngezingilazi Ze-Quartz

Q1: Yiziphi izinto ezingasetshenziswa umshini ukusika?
A1:Kwenzelwe i-SiC, i-sapphire, i-quartz, i-silicon, i-ceramics, ingilazi ebonakalayo, kanye namatshe ayigugu.

Umbuzo 2: Inqubo yokusika inembe kangakanani?
A2:Kuma-wafer e-SiC angu-6-intshi, ukunemba kobukhulu kungafinyelela ku-<3 μm, ngekhwalithi ephezulu kakhulu.

Umbuzo 3: Kungani ukusika ucingo lwedayimane kungcono kunezindlela zendabuko?
A3:Inikeza isivinini esisheshayo, ukulahleka kwe-kerf okuncishisiwe, umonakalo omncane wokushisa, kanye nemiphetho ebushelelezi uma kuqhathaniswa nezintambo ezihudulayo noma ukusika nge-laser.

Umbuzo 4: Ingabe ingacubungula izimo eziyisilinda noma ezingajwayelekile?
A4:Yebo. Ngesigaba sokujikeleza esingakhethwa, singenza ukusika okujikelezayo, okugobile, nokugobile ezindongeni noma kumaphrofayili akhethekile.

UMBUZO 5: Kulawulwa kanjani ukucindezelwa kwentambo?
A5:Uhlelo lusebenzisa ukulungiswa kokucindezelwa okuzenzakalelayo kwe-closed-loop ngokunemba okungu-±0.5 N ukuvimbela ukuphuka kwentambo nokuqinisekisa ukusika okuzinzile.

Umbuzo 6: Yiziphi izimboni ezisebenzisa lobu buchwepheshe kakhulu?
A6:Ukukhiqizwa kwe-semiconductor, amandla elanga, i-LED kanye ne-photonics, ukwenziwa kwezingxenye ze-optical, ubucwebe, kanye ne-aerospace ceramics.

Mayelana NATHI

I-XKH igxile ekuthuthukisweni kobuchwepheshe obuphezulu, ekukhiqizweni, nasekuthengisweni kwengilazi ekhethekile ye-optical kanye nezinto ezintsha zekristalu. Imikhiqizo yethu ihlinzeka nge-optical electronics, i-consumer electronics, kanye nezempi. Sinikeza izingxenye ze-optical ze-Sapphire, izembozo zelensi yeselula, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kanye nama-semiconductor crystal wafers. Ngobuchwepheshe obunekhono kanye nemishini esezingeni eliphezulu, sihamba phambili ekucutshungulweni komkhiqizo okungewona ojwayelekile, sihlose ukuba yibhizinisi elihamba phambili lezinto ze-optoelectronic tech.

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