Ibhokisi lokuthutha lebhokisi lesikwele elenziwe ngokwezifiso

Izinzuzo zama-wafer okuthumela emabhokisini okuthumela ayisikwele zifaka:

1--Ukusetshenziswa kwesikhala esikhulu: Amabhokisi okuthumela ayisikwele ngokuvamile aklanywa ukuba abe mancane kakhulu, okuvumela ukusetshenziswa kahle kwendawo yokuthumela neyokugcina impahla kanye nokunciphisa imfucuza.

2--Ukuzinza: Amabhokisi okuthumela ayisikwele avame ukuklanywa ukuze ahlinzeke ngesakhiwo sokusekela esizinzile esiza ukuvikela ama-wafer ekudlidlizeni nasekushaqekeni.

3--Ukubeka Okulula: Ngenxa yokuma kwamabhokisi okuthumela ayizikwele, avame ukuhlanganiswa kalula ukuze kongiwe indawo yokugcina kanye neyokuthutha.

4--Ukulula kokuphathwa okuzenzakalelayo: Ukuma nokwakheka kwamabhokisi okuthumela ayisikwele kwenza kube lula ukuzivumelanisa nezinhlelo zokuphatha okuzenzakalelayo, okwandisa umkhiqizo.

Sekukonke, amabhokisi okuthumela ayizikwele ahlinzeka ngokusebenza kahle okukhulu, ukuzinza kanye nokusetshenziswa kwesikhala lapho kuthuthwa ama-wafer, okwenza abe yisitsha esivamile sokuthumela ama-wafer.

Yakhiwe ngezinto ze-ABS eziqinile futhi inezikhala ezingu-25, la mabhokisi okugcina impahla anikeza isikhala esanele sokuhlela nokuvikela ama-wafer ngesikhathi sokuphathwa nokuthuthwa. Ngokwakhiwa kwawo okuqinile kanye nomklamo oqondile, amabhokisi ethu okuthumela ama-wafer aqinisekisa ukuthi ama-wafer athuthwa ngokuphephile aye lapho eya khona, egcina ubuqotho bawo kanye nekhwalithi yawo kulo lonke uhambo lwawo. Afanelekela izindawo zokukhiqiza ze-semiconductor kanye nama-lab ocwaningo, la mabhokisi okugcina impahla anikeza ikhambi elithembekile lokugcina nokuthutha ama-wafer kalula nangokulula.