Lapho sihlola amawafer e-silicon e-semiconductor noma ama-substrates enziwe ngezinye izinto, sivame ukuhlangana nezinkomba zobuchwepheshe ezifana ne-TTV, BOW, WARP, kanye ne-TIR, STIR, LTV, phakathi kwezinye. Yimaphi amapharamitha amele lokhu?
I-TTV - Ukuhlukahluka Kokuqina Okuphelele
KHOTHWA — Bow
I-WARP - I-Wap
I-TIR — Isamba Sokufunda Okubonisiwe
I-STIR - Isamba Sokufunda Okubonisiwe Sesayithi
I-LTV - Ukuhlukahluka Kokuqina Kwendawo
1. Ukwehluka Kobukhulu Obuphelele — TTV
Umehluko phakathi kobukhulu nobukhulu obuncane be-wafer ehlobene nendiza yereferensi lapho i-wafer iboshiwe futhi iseduze. Ivamise ukuvezwa ngama-micrometers (μm), ngokuvamile amelelwa njengalokhu: ≤15 μm.
2. IQINISO - KHOTHWA
Ukuchezuka phakathi kwebanga elincane neliwumkhawulo ukusuka endaweni emaphakathi yendawo eyilucwecwana ukuya endizeni eyireferensi lapho i-wafer isesimweni samahhala (esingahlanganisiwe). Lokhu kuhlanganisa kokubili amakesi e-concave (negative bow) kanye ne-convex (umnsalo oqondile). Ivamise ukuvezwa ngama-micrometers (μm), ngokuvamile amelelwa ngokuthi: ≤40 μm.
3. I-WARP
Ukuchezuka phakathi kwebanga elincane neliwumkhawulo ukusuka endaweni eyicwecwe ukuya endizeni eyireferensi (imvamisa indawo engemuva ye-wafer) lapho i-wafer isesimweni samahhala (esingabanjwanga). Lokhu kufaka phakathi amacala amabili e-concave (negative warp) kanye ne-convex (positive warp). Ivamise ukuvezwa ngama-micrometers (μm), avame ukumelelwa njengalokhu: ≤30 μm.
4. Ingqikithi Yokufunda Okubonisiwe — TIR
Lapho i-wafer iboshiwe futhi isondelene kakhulu, kusetshenziswa indiza eyinkomba enciphisa isamba sokunqamuka kwawo wonke amaphuzu ngaphakathi kwendawo yekhwalithi noma isifunda sendawo esicacisiwe endaweni eyi-wafer, i-TIR iwukuchezuka phakathi kwebanga eliwumkhawulo nelincane ukusuka endaweni eyi-wafer kuya kule ndiza eyireferensi.
Isekelwe ebuchwephesheni obujulile ekucacisweni kwempahla ye-semiconductor njenge-TTV, BOW, WARP, ne-TIR, i-XKH inikeza izinsizakalo zokucubungula amawafa angokwezifiso ahambisana nezindinganiso eziqinile zomkhakha. Sihlinzeka futhi sisekela uhla olubanzi lwezinto ezisebenza kahle ezihlanganisa isafire, i-silicon carbide (SiC), ama-silicon wafers, i-SOI, ne-quartz, ukuqinisekisa ukucaba okukhethekile, ukungaguquguquki, kanye nekhwalithi ephezulu yezinhlelo zokusebenza ezithuthukisiwe ku-optoelectronics, amadivayisi kagesi, ne-MEMS. Sithembe ukuthi sizokulethela izisombululo zezinto ezibonakalayo ezinokwethenjelwa kanye nemishini enembayo ehlangabezana nezidingo zakho zedizayini ezidinga kakhulu.
Isikhathi sokuthumela: Aug-29-2025



