Kusho ukuthini i-TTV, i-BOW, i-WARP, ne-TIR kuma-Wafers?

Uma sihlola ama-wafer e-silicon e-semiconductor noma ama-substrate enziwe ngezinye izinto, sivame ukuhlangana nezinkomba zobuchwepheshe ezifana nalezi: i-TTV, i-BOW, i-WARP, kanye ne-TIR, i-STIR, i-LTV, phakathi kwezinye. Yimaphi amapharamitha amele lokhu?

I-TTV — Ukwehluka Kobukhulu Obuphelele
Umnsalo — Umnsalo
I-WARP — I-Warp
I-TIR — Ukufundwa Okuphelele Okubonisiwe
I-STIR — Isayithi Lonke Ukufundwa Okubonisiwe
I-LTV — Ukwehluka Kobukhulu Bendawo

1. Ukwehluka Kobukhulu Obuphelele — TTV

Umehluko phakathi kobukhulu obukhulu nobuncane be-wafer uma kuqhathaniswa ne-reference plane lapho i-wafer iboshwe futhi isondelene. Ngokuvamile ivezwa ngama-micrometer (μm), evame ukumelelwa kanje: ≤15 μm.

2. Umnsalo — Umnsalo

Ukuphambuka phakathi kwebanga elincane neliphezulu ukusuka endaweni ephakathi nendawo ebusweni be-wafer kuya endaweni yokubhekisela lapho i-wafer isesimweni esikhululekile (esingafakwanga isibambo). Lokhu kufaka phakathi kokubili izimo ze-concave (negative bow) kanye ne-convex (positive bow). Ngokuvamile ivezwa kuma-micrometer (μm), ngokuvamile amelelwa kanje: ≤40 μm.

3. I-Warp — I-WARP

Ukuphambuka phakathi kwebanga elincane neliphezulu ukusuka ebusweni be-wafer kuya endaweni yokubhekisela (ngokuvamile ubuso bangemuva be-wafer) lapho i-wafer isesimweni esikhululekile (esingavaliwe). Lokhu kufaka phakathi kokubili izimo ze-concave (negative warp) kanye ne-convex (positive warp). Ngokuvamile ivezwa kuma-micrometer (μm), evame ukumelelwa ngokuthi: ≤30 μm.

4. Ukufundwa Okuphelele Okubonisiwe — TIR

Uma i-wafer iboshwe futhi isondelene, kusetshenziswa i-reference plane enciphisa inani le-intercepts yazo zonke izindawo ezisezingeni noma indawo ethile endaweni ethile ebusweni be-wafer, i-TIR iwukuphambuka phakathi kwamabanga aphezulu naphansi ukusuka ebusweni be-wafer kuya kule nombolo yokubhekisela.

Isekelwe kubuchwepheshe obujulile ekucacisweni kwezinto ze-semiconductor ezifana ne-TTV, i-BOW, i-WARP, kanye ne-TIR, i-XKH inikeza izinsizakalo zokucubungula i-wafer ngokwezifiso ezenziwe ngokwezifiso ezilungiselelwe amazinga aqinile embonini. Sihlinzeka futhi sisekela uhla olubanzi lwezinto zokusebenza okuphezulu okuhlanganisa i-sapphire, i-silicon carbide (SiC), ama-wafer e-silicon, i-SOI, kanye ne-quartz, siqinisekisa ukuthi i-flatness eyingqayizivele, ukuqina okuqinile, kanye nekhwalithi yobuso bezinhlelo zokusebenza ezithuthukisiwe kuma-optoelectronics, amadivayisi kagesi, kanye ne-MEMS. Sithembe ukuthi sizoletha izixazululo zezinto ezithembekile kanye nomshini wokulungisa onembile ohlangabezana nezidingo zakho zomklamo ezidinga kakhulu.