Njengoba kuqhubeka intuthuko yobuchwepheshe be-semiconductor, embonini ye-semiconductor ngisho nasembonini ye-photovoltaic, izidingo zekhwalithi ephezulu ye-wafer substrate noma i-epitaxial sheet nazo ziqinile kakhulu. Ngakho-ke, yiziphi izidingo zekhwalithi zama-wafer?i-wafer yesafireIsibonelo, yiziphi izinkomba ezingasetshenziswa ukuhlola ikhwalithi yobuso bama-wafer?
Yiziphi izinkomba zokuhlola ama-wafer?
Izinkomba ezintathu
Kuma-wafer e-sapphire, izinkomba zawo zokuhlola yi-total thickness deviation (TTV), i-bend (Bow) kanye ne-Warp (Warp). Lawa mapharamitha amathathu ndawonye abonisa ukufana kwe-flatness kanye ne-thickness ye-silicon wafer, futhi angalinganisa izinga le-ripple ye-wafer. I-corrugation ingahlanganiswa ne-flatness ukuze kuhlolwe ikhwalithi yendawo ye-wafer.
Kuyini i-TTV, i-BOW, ne-Warp?
I-TTV (Ukwehluka Kobukhulu Obuphelele)
I-TTV umehluko phakathi kobukhulu obukhulu nobuncane be-wafer. Le pharamitha iyinkomba ebalulekile esetshenziselwa ukukala ukufana kobukhulu be-wafer. Enqubweni ye-semiconductor, ubukhulu be-wafer kumele bufane kakhulu phezu kobuso bonke. Izilinganiso zivame ukwenziwa ezindaweni ezinhlanu ku-wafer futhi umehluko uyabalwa. Ekugcineni, leli nani liyisisekelo esibalulekile sokwahlulela ikhwalithi ye-wafer.
Umnsalo
Ukugoba ekukhiqizweni kwe-semiconductor kubhekisela ekugobeni kwe-wafer, okukhulula ibanga phakathi kwephuzu eliphakathi le-wafer engafakwanga kanye nendiza yokubhekisela. Leli gama cishe livela encazelweni yesimo sento lapho igobile, njengesimo esigobile somnsalo. Inani le-Bow lichazwa ngokulinganisa ukuphambuka phakathi kwesikhungo kanye nomkhawulo we-wafer ye-silicon. Leli nani livame ukuvezwa ngama-micrometer (µm).
I-Warp
I-Warp iyimpahla yomhlaba wonke yama-wafer elinganisa umehluko phakathi kwebanga eliphezulu nelincane phakathi kwebanga eliphakathi kwe-wafer engavuleki kalula kanye ne-reference plane. Imelela ibanga ukusuka ebusweni be-wafer ye-silicon kuya endizeni.
Uyini umehluko phakathi kwe-TTV, i-Bow, ne-Warp?
I-TTV igxile ekushintsheni kobukhulu futhi ayikhathazeki ngokugoba noma ukuphambuka kwe-wafer.
Umnsalo ugxila ekugobeni okuphelele, ikakhulukazi uma ucabangela ukugoba kwephuzu eliphakathi nendawo kanye nomphetho.
I-Warp ibanzi kakhulu, okuhlanganisa ukugoba nokusonta indawo yonke ye-wafer.
Nakuba la mapharamitha amathathu ahlobene nokuma kanye nezakhiwo zejiyometri ze-silicon wafer, alinganiswa futhi achazwa ngendlela ehlukile, futhi umthelela wawo enqubweni ye-semiconductor kanye nokucutshungulwa kwe-wafer nawo uhlukile.
Uma amapharamitha amathathu emancane, kuba ngcono, futhi uma ipharamitha inkulu, kulapho umthelela omubi enqubweni ye-semiconductor uba mkhulu khona. Ngakho-ke, njengochwepheshe we-semiconductor, kumele siqaphele ukubaluleka kwamapharamitha ephrofayili ye-wafer kuyo yonke inqubo yenqubo, senze inqubo ye-semiconductor, futhi kufanele sinake imininingwane.
(ukuhlola)
Isikhathi sokuthunyelwe: Juni-24-2024