Ngokuthuthuka okuqhubekayo kobuchwepheshe be-semiconductor, embonini ye-semiconductor ngisho nemboni ye-photovoltaic, izidingo zekhwalithi engaphezulu ye-wafer substrate noma ishidi le-epitaxial nazo ziqinile kakhulu.Ngakho-ke, yiziphi izidingo zekhwalithi zama-wafers?Uma sithatha amawafa amasafire njengesibonelo, yiziphi izinkomba ezingasetshenziswa ukuhlola ikhwalithi engaphezulu yamawafa?
Yiziphi izinkomba zokuhlola ama-wafers?
Izinkomba Ezintathu
Kumawafa esafire, izinkomba zawo zokuhlola ukuchezuka kokuqina okuphelele (TTV), ukugoba (umnsalo) kanye ne-Warp (I-Warp).Lawa mapharamitha amathathu ehlangene akhombisa ukucaba nokufana kogqinsi kwewafa ye-silicon, futhi angakala izinga lokunyakaza kwewafa.I-corrugation ingahlanganiswa nokucaba ukuze kuhlolwe ikhwalithi ye-wafer surface.
Yini i-TTV, BOW, Warp?
I-TTV (Total Thickness Variation)
I-TTV ingumehluko phakathi kobukhulu nobuncane bokujiya be-wafer.Le pharamitha iyinkomba ebalulekile esetshenziselwa ukukala ukufana kwe-wafer.Enqubweni ye-semiconductor, ubukhulu be-wafer kumele bufane kakhulu phezu kwendawo yonke.Izilinganiso zivame ukwenziwa ezindaweni ezinhlanu ku-wafer futhi umehluko ubalwa.Ekugcineni, leli nani liyisisekelo esibalulekile sokwahlulela ikhwalithi ye-wafer.
Khothama
I-Bow in semiconductor production ibhekisela ekugobeni kwe-wafer, okukhulula ibanga eliphakathi kwephoyinti elimaphakathi lewafa engavaliwe kanye nendiza eyireferensi.Leli gama cishe livela encazelweni yokuma kwento lapho igobile, njengokuma komnsalo ogobile.Inani le-Bow lichazwa ngokulinganisa ukuchezuka phakathi kwesikhungo nonqenqema lwewafa ye-silicon.Leli nani livamise ukuvezwa ngama-micrometers (µm).
I-Wap
I-Warp iyimpahla yomhlaba wonke yama-wafers akala umehluko phakathi kwebanga eliphezulu nelincane phakathi kwemaphakathi ne-wafer engacishiwe ngokukhululekile kanye nendiza eyireferensi.Imele ibanga ukusuka ebusweni bewafa ye-silicon ukuya endizeni.
Uyini umehluko phakathi kwe-TTV, Bow, Warp?
I-TTV igxile ekushintsheni kobukhulu futhi ayinandaba nokugoba noma ukuhlanekezelwa kwe-wafer.
Umnsalo ugxile ekugobeni jikelele, ikakhulukazi kucatshangelwa ukugoba kwephuzu elimaphakathi kanye nonqenqema.
I-Warp ibanzi, okuhlanganisa ukugoba nokusonteka kwayo yonke indawo eyi-wafer.
Nakuba lezi zinhlaka ezintathu zihlobene nokuma kanye nezakhiwo zejometri ze-silicon wafer, ziyalinganiswa futhi zichazwe ngendlela ehlukile, futhi umthelela wazo kunqubo ye-semiconductor kanye nokucubungula kwe-wafer nakho kuhlukile.
Uma amapharamitha amathathu emincane, ngcono, futhi ipharamitha ibe mikhudlwana, kuba nomthelela omubi kakhulu kunqubo ye-semiconductor.Ngakho-ke, njengomsebenzi we-semiconductor, kufanele siqaphele ukubaluleka kwamapharamitha wephrofayela ye-wafer kuyo yonke inqubo yenqubo, inqubo yokwenza i-semiconductor, kufanele sinake imininingwane.
(i-censoring)
Isikhathi sokuthumela: Jun-24-2024