Izinzuzo zeI-Through Glass Via (TGV)kanye nezinqubo ze-Through Silicon Via(TSV) phezu kwe-TGV ngokuyinhloko yilezi:
(1) izici zikagesi ezinhle kakhulu ezisebenza ngesivinini esiphezulu. Izinto zengilazi ziyinto yokuvikela, i-dielectric constant icishe ibe yi-1/3 kuphela yezinto ze-silicon, kanti isici sokulahlekelwa siphansi ngama-oda angu-2-3 ngobukhulu kunezinto ze-silicon, okwenza ukulahlekelwa kwe-substrate kanye nemiphumela ye-parasitic kunciphe kakhulu futhi kuqinisekisa ubuqotho besiginali edlulisiwe;
(2)usayizi omkhulu kanye ne-substrate yengilazi encane kakhuluKulula ukuyithola. I-Corning, i-Asahi kanye ne-SCHOTT kanye nabanye abakhiqizi beglasi banganikeza ingilazi yephaneli enobukhulu obukhulu kakhulu (>2m × 2m) kanye nengilazi yephaneli enobukhulu obuncane kakhulu (<50µm) kanye nezinto zengilazi eziguquguqukayo ezinobukhulu obuncane kakhulu.
3) Izindleko eziphansi. Zuza ekufinyeleleni kalula engilazini yephaneli enkulu enobukhulu obuncane kakhulu, futhi ayidingi ukufakwa kwezingqimba zokuvikela, izindleko zokukhiqiza ipuleti le-adapter yengilazi cishe ziyi-1/8 kuphela yepuleti le-adapter elisekelwe ku-silicon;
4) Inqubo elula. Asikho isidingo sokufaka ungqimba lokuvikela phezu kobuso be-substrate kanye nodonga lwangaphakathi lwe-TGV, futhi akudingeki ukuncishiswa kwe-adapter plate enciphile kakhulu;
(5) Ukuqina okuqinile kwemishini. Ngisho noma ubukhulu bepuleti le-adaptha bungaphansi kuka-100µm, i-warpage isencane;
(6) Uhla olubanzi lwezicelo, ubuchwepheshe obusha bokuxhumana obude obusetshenziswa emkhakheni wokupakisha ezingeni le-wafer, ukuze kufinyelelwe ibanga elifushane phakathi kwe-wafer-wafer, i-pitch encane ye-interconnect inikeza indlela entsha yobuchwepheshe, enezakhiwo zikagesi, ezishisayo, zemishini ezinhle kakhulu, ku-chip ye-RF, izinzwa ze-MEMS eziphezulu, ukuhlanganiswa kwesistimu ephezulu kanye nezinye izindawo ezinezinzuzo eziyingqayizivele, yisizukulwane esilandelayo se-chip ye-5G, 6G ephezulu ye-chip 3D. Ingenye yezinketho zokuqala zokupakisha kwe-3D kwama-chip e-5G aphezulu esizukulwaneni esilandelayo kanye ne-6G ephezulu.
Inqubo yokubumba ye-TGV ifaka phakathi ukuqhumisa isihlabathi, ukubhoboza nge-ultrasonic, ukugoba okumanzi, ukugoba okujulile kwe-ion, ukugoba okuzwela ukukhanya, ukugoba nge-laser, ukugoba okujulile okubangelwa yi-laser, kanye nokwakheka kwembobo yokukhipha egxile.
Imiphumela yocwaningo lwakamuva kanye nentuthuko ikhombisa ukuthi ubuchwepheshe bungalungiselela ngemigodi kanye nemigodi eyi-blind engu-5:1 enesilinganiso sokujula nobubanzi esingu-20:1, futhi bunokwakheka okuhle. Ukugoba okujulile okubangelwa yi-laser, okuholela ekuqineni okuncane kobuso, kuyindlela efundwe kakhulu okwamanje. Njengoba kuboniswe kuMfanekiso 1, kunemifantu esobala ezungeze ukubhoboza okuvamile kwe-laser, kuyilapho izindonga ezizungezile kanye nezindonga eziseceleni zokugoba okujulile okubangelwa yi-laser zihlanzekile futhi zibushelelezi.
Inqubo yokucubungulaI-TGVI-interposer iboniswe kuMfanekiso 2. Uhlelo oluphelele ukubhoboza imigodi ku-substrate yengilazi kuqala, bese kufakwa ungqimba lwesithiyo kanye nengqimba yembewu odongeni oluseceleni nasodongeni. Ungqimba lwesithiyo luvimbela ukusabalala kwe-Cu ku-substrate yengilazi, kuyilapho kwandiswa ukunamathelana kwalokhu okubili, vele, kwezinye izifundo kutholakale nokuthi ungqimba lwesithiyo aludingeki. Ngemuva kwalokho i-Cu ifakwa nge-electroplating, bese i-annealed, bese ungqimba lwe-Cu lususwa yi-CMP. Ekugcineni, ungqimba lwe-RDL rewiring lulungiswa yi-PVD coating lithography, bese ungqimba lwe-passivation lwakhiwa ngemva kokususwa kweglue.
(a) Ukulungiswa kwe-wafer, (b) ukwakheka kwe-TGV, (c) i-electroplating enezinhlangothi ezimbili – ukufakwa kwethusi, (d) ukupholisha ngamakhemikhali kanye ne-CMP, ukususwa kwengqimba yethusi engaphezulu, (e) ukumbozwa kwe-PVD kanye ne-lithography, (f) ukufakwa kwengqimba yokuphinda izintambo ze-RDL, (g) ukususa iglu kanye nokuqoshwa kwe-Cu/Ti, (h) ukwakheka kwengqimba yokudlulisa.
Ngamafuphi,ingilazi edlula emgodini (TGV)Amathemba okusetshenziswa abanzi, futhi imakethe yasekhaya yamanje isesigabeni esikhulayo, kusukela emishinini kuya ekwakhiweni komkhiqizo kanye nezinga lokukhula kocwaningo nentuthuko liphakeme kunesilinganiso somhlaba wonke.
Uma kukhona ukwephulwa komthetho, xhumana no-Delete
Isikhathi sokuthunyelwe: Julayi-16-2024