Izinzuzo zeNge-Glass Via (TGV)futhi Nge-Silicon Via(TSV) izinqubo nge-TGV ikakhulukazi:
(1) izici ezinhle kakhulu zikagesi we-high-frequency. I-Glass impahla iyimpahla ye-insulator, i-dielectric engaguquki imayelana ne-1/3 kuphela yezinto ze-silicon, futhi isici sokulahlekelwa singama-oda angu-2-3 obukhulu obuphansi kunalowo wezinto ze-silicon, okwenza ukulahlekelwa kwe-substrate kanye nemiphumela ye-parasitic kunciphise kakhulu futhi iqinisekise ubuqotho besignali edlulisiwe;
(2)usayizi omkhulu kanye ne-ultra-thin glass substratekulula ukuyithola. I-Corning, i-Asahi ne-SCHOTT kanye nabanye abakhiqizi bezingilazi bangahlinzeka ngosayizi omkhulu kakhulu (>2m × 2m) kanye nengilazi yephaneli emincane kakhulu (<50µm) nezinto zengilazi eziguquguquka kakhulu.
3) Izindleko eziphansi. Zuza ekufinyeleleni okulula kwengilazi yephaneli yobukhulu obukhulu obuncane, futhi ayidingi ukubekwa kwezingqimba zokuvikela, izindleko zokukhiqiza ipuleti ye-adaptha yengilazi cishe yi-1/8 kuphela yepuleti ye-adaptha esekwe ku-silicon;
4) Inqubo elula. Asikho isidingo sokufaka isendlalelo se-insulating endaweni engaphansi kanye nodonga lwangaphakathi lwe-TGV, futhi akukho ukucwenga okudingekayo epuletini le-adaptha elincanyana kakhulu;
(5) Ukuzinza okuqinile kwemishini. Noma ubukhulu bepuleti le-adaptha bungaphansi kuka-100µm, ikhasi le-warpage liselincane;
(6) Uhlu olubanzi lwezinhlelo zokusebenza, wubuchwepheshe obusafufusa bokuxhumanisa ubude besikhathi eside obusetshenziswa emkhakheni wokupakishwa kwe-wafer-level, ukuze kuzuzwe ibanga elifushane kakhulu phakathi kwe-wafer-wafer, i-pitch encane ye-interconnect inikeza indlela entsha yobuchwepheshe, enezindawo ezinhle kakhulu zikagesi, ezishisayo, zemishini, ku-chip RF, i-high-end MEMS izinzwa, i-high-dens system, i-high-dens system, i-high-dens, i-MEMS system, i-high-dens, nezinye izinzwa ze-MEMS. I-5G, 6G high-frequency chip 3D Ingenye yezinketho zokuqala zokupakishwa kwe-3D kwesizukulwane esilandelayo se-5G kanye ne-6G yama-chips anemvamisa ephezulu.
Inqubo yokubumba ye-TGV ikakhulukazi ihlanganisa i-sandblasting, ukubhola nge-ultrasonic, i-etching emanzi, i-deep reactive ion etching, i-photosensitive etching, i-laser etching, i-laser-induced deep etching, kanye nokugxila ekubunjweni kwemigodi yokukhipha.
Imiphumela yakamuva yocwaningo nentuthuko ibonisa ukuthi ubuchwepheshe bungalungiselela ngokusebenzisa izimbobo kanye nemigodi eyimpumputhe engu-5:1 enesilinganiso sokujula nobubanzi esingu-20:1, futhi ibe ne-morphology enhle. I-laser eyengelwe ukujula okujulile, okuholela ebuhleni obuncane bendawo, kuyindlela efundwa kakhulu njengamanje. Njengoba kukhonjisiwe kuMfanekiso 1, kunemifantu esobala ezungeze ukubhoboza i-laser evamile, kuyilapho izindonga ezizungezile nezasemaceleni ze-laser-induced deep etching zihlanzekile futhi zibushelelezi.
Inqubo yokucubungula yeI-TGVi-interposer ikhonjisiwe kuMfanekiso 2. Uhlelo lulonke ukubhoboza izimbobo engxenyeni yengilazi kuqala, bese ufaka ungqimba oluvimbelayo nongqimba lwembewu odongeni oluseceleni nangaphezulu. Isendlalelo sokuvimbela sivimbela ukusakazeka kwe-Cu ku-substrate yengilazi, kuyilapho kwandisa ukunamathela kokubili, yiqiniso, kwezinye izifundo futhi bathola ukuthi ungqimba lokuvimbela akudingekile. Bese i-Cu ifakwa nge-electroplating, bese i-anneal, bese ungqimba lwe-Cu lususwa yi-CMP. Ekugcineni, isendlalelo se-RDL rewiring silungiswa nge-PVD coating lithography, futhi isendlalelo se-passivation sakhiwe ngemva kokususwa kweglue.
(a) Ukulungiswa kwe-wafer, (b) ukwakheka kwe-TGV, (c) i-electroplating enezinhlangothi ezimbili - ukufakwa kwethusi, (d) ukupholishwa kwamakhemikhali e-CMP, ukususwa kongqimba lwethusi olungaphezulu, (e) ungqimba lwe-PVD kanye ne-lithography, (f) ukubekwa kwe-RDL rewiring layer, (g) i-degluing, i-pass (i-Cu/Ti) ye-eformation.
Ngamafuphi,ingilazi ngembobo (TGV)amathemba okufaka isicelo abanzi, futhi imakethe yasekhaya yamanje isezingeni elikhulayo, kusukela kumishini iye ekwakhiweni komkhiqizo kanye nocwaningo kanye nezinga lokukhula lokuthuthuka lingaphezulu kwesilinganiso somhlaba.
Uma kukhona ukwephulwa komthetho, susa othintana naye
Isikhathi sokuthumela: Jul-16-2024