Izinzuzo zeNge-Glass Via (TGV)futhi Nge-Silicon Via(TSV) izinqubo nge-TGV ikakhulukazi:
(1) izici ezinhle kakhulu zikagesi we-high-frequency. Izinto zengilazi ziyi-insulator, i-dielectric engaguquki icishe ibe yi-1/3 kuphela yezinto ze-silicon, futhi isici sokulahlekelwa singama-oda angu-2-3 obukhulu obuphansi kunalowo wezinto ze-silicon, okwenza ukulahleka kwe-substrate kanye nemiphumela ye-parasitic yehliswe kakhulu. futhi iqinisekisa ubuqotho besignali edlulisiwe;
(2)usayizi omkhulu kanye ne-ultra-thin glass substratekulula ukuyithola. I-Corning, i-Asahi ne-SCHOTT kanye nabanye abakhiqizi bezingilazi bangahlinzeka ngosayizi omkhulu kakhulu (>2m × 2m) kanye nengilazi yephaneli emincane kakhulu (<50µm) nezinto zengilazi eziguquguquka kakhulu.
3) Izindleko eziphansi. Zuza ekufinyeleleni okulula kwengilazi yephaneli yobukhulu obukhulu obuncane, futhi ayidingi ukubekwa kwezingqimba zokuvikela, izindleko zokukhiqiza ipuleti ye-adaptha yengilazi cishe yi-1/8 kuphela yepuleti ye-adaptha esekwe ku-silicon;
4) Inqubo elula. Asikho isidingo sokufaka isendlalelo se-insulating endaweni engaphansi kanye nodonga lwangaphakathi lwe-TGV, futhi akukho ukucwenga okudingekayo epuletini le-adaptha elincanyana kakhulu;
(5) Ukuzinza okuqinile kwemishini. Noma ubukhulu bepuleti le-adaptha bungaphansi kuka-100µm, ikhasi le-warpage liselincane;
(6) Uhlu olubanzi lwezinhlelo zokusebenza, wubuchwepheshe obuvelayo bokuxhumanisa ubude besikhathi obusetshenziswa emkhakheni wokupakishwa kwezinga lelucwecwana, ukuze kuzuzwe ibanga elifushane kakhulu phakathi kwesinkwa esilucwecwana, ukuphakama okuncane kokuxhuma kuhlinzeka ngendlela entsha yobuchwepheshe, enogesi omuhle kakhulu. , izakhiwo ezishisayo, zemishini, ku-chip ye-RF, izinzwa ze-MEMS eziphezulu, ukuhlanganiswa kwesistimu ephezulu kakhulu nezinye izindawo ezinezinzuzo eziyingqayizivele, isizukulwane esilandelayo se-5G, i-6G high-frequency chip 3D Ingenye yezinketho zokuqala Ukupakishwa kwe-3D kwesizukulwane esilandelayo se-5G kanye ne-6G yama-chips avamile.
Inqubo yokubumba ye-TGV ikakhulukazi ihlanganisa i-sandblasting, ukubhola nge-ultrasonic, i-etching emanzi, i-deep reactive ion etching, i-photosensitive etching, i-laser etching, i-laser-induced deep etching, kanye nokugxila ekubunjweni kwemigodi yokukhipha.
Imiphumela yakamuva yocwaningo nentuthuko ibonisa ukuthi ubuchwepheshe bungalungiselela ngokusebenzisa izimbobo kanye nemigodi eyimpumputhe engu-5:1 enesilinganiso sokujula nobubanzi esingu-20:1, futhi ibe ne-morphology enhle. I-laser eyengelwe ukujula okujulile, okuholela ebuhleni obuncane bendawo, kuyindlela efundwa kakhulu njengamanje. Njengoba kukhonjisiwe kuMfanekiso 1, kunemifantu esobala ezungeze ukubhoboza i-laser evamile, kuyilapho izindonga ezizungezile nezasemaceleni ze-laser-induced deep etching zihlanzekile futhi zibushelelezi.
Inqubo yokucubungula yeI-TGVi-interposer ikhonjisiwe kuMfanekiso 2. Uhlelo lulonke ukubhoboza izimbobo engxenyeni yengilazi kuqala, bese ufaka ungqimba oluvimbelayo nongqimba lwembewu odongeni oluseceleni nangaphezulu. Isendlalelo sokuvimbela sivimbela ukusakazeka kwe-Cu ku-substrate yengilazi, kuyilapho kwandisa ukunamathela kokubili, yiqiniso, kwezinye izifundo futhi bathola ukuthi ungqimba lokuvimbela akudingekile. Bese i-Cu ifakwa nge-electroplating, bese i-annealed, bese ungqimba lwe-Cu lususwa yi-CMP. Ekugcineni, isendlalelo se-RDL rewiring silungiswa nge-PVD coating lithography, futhi isendlalelo se-passivation sakhiwe ngemva kokususwa kweglue.
(a) Ukulungiswa kwe-wafer, (b) ukwakhiwa kwe-TGV, (c) i-electroplating enezinhlangothi ezimbili - ukubekwa kwethusi, (d) ukupholisha amakhemikhali kanye ne-CMP ngamakhemikhali, ukususwa kongqimba lwethusi olungaphezulu, (e) ukunamathela kwe-PVD kanye ne-lithography , (f) ukubekwa kwe-RDL rewiring layer, (g) degluing kanye ne-Cu/Ti etching, (h) ukwakheka kwe-passivation layer.
Ngamafuphi,ingilazi ngembobo (TGV)amathemba okufaka isicelo abanzi, futhi imakethe yasekhaya yamanje isezingeni elikhulayo, kusukela kumishini iye ekwakhiweni komkhiqizo kanye nocwaningo kanye nezinga lokukhula lokuthuthuka lingaphezulu kwesilinganiso somhlaba.
Uma kukhona ukwephulwa komthetho, susa othintana naye
Isikhathi sokuthumela: Jul-16-2024