Ubuchwepheshe Bokuhlanza Ama-Wafer Ekukhiqizeni Ama-Semiconductor

Ubuchwepheshe Bokuhlanza Ama-Wafer Ekukhiqizeni Ama-Semiconductor

Ukuhlanzwa kwe-wafer kuyisinyathelo esibalulekile kuyo yonke inqubo yokukhiqiza i-semiconductor futhi kungenye yezinto ezibalulekile ezithinta ngqo ukusebenza kwedivayisi kanye nokukhiqiza kwayo. Ngesikhathi sokwenziwa kwe-chip, ngisho nokungcola okuncane kakhulu kungonakalisa izici zedivayisi noma kubangele ukwehluleka ngokuphelele. Ngenxa yalokho, izinqubo zokuhlanza ziyasetshenziswa ngaphambi nangemva kwazo zonke izinyathelo zokukhiqiza ukuze kususwe ukungcola okungaphezulu futhi kuqinisekiswe ukuhlanzeka kwe-wafer. Ukuhlanza futhi kuyindlela evame kakhulu ekukhiqizweni kwe-semiconductor, okubalwa cishe30% wazo zonke izinyathelo zenqubo.

Ngokukhula okuqhubekayo kokuhlanganiswa okukhulu kakhulu (i-VLSI), ama-process node athuthuke kakhulu.28 nm, 14 nm, nangale kwalokho, okuqhuba ukuminyana kwamadivayisi aphezulu, ububanzi bemigqa emincane, kanye nokugeleza kwenqubo okuyinkimbinkimbi ngokwengeziwe. Ama-node athuthukile azwela kakhulu ekungcoleni, kuyilapho osayizi bezici ezincane benza ukuhlanza kube nzima kakhulu. Ngenxa yalokho, inani lezinyathelo zokuhlanza liyaqhubeka nokukhula, futhi ukuhlanza sekuyinkimbinkimbi kakhulu, kubaluleke kakhulu, futhi kuyinselele kakhulu. Isibonelo, i-chip engu-90 nm ivame ukudinga cisheIzinyathelo zokuhlanza ezingu-90, kuyilapho i-chip engu-20 nm idinga cisheIzinyathelo zokuhlanza ezingu-215Njengoba ukukhiqiza kuqhubekela phambili ku-14 nm, 10 nm, kanye nama-node amancane, inani lemisebenzi yokuhlanza lizoqhubeka nokukhula.

Empeleni,Ukuhlanza i-wafer kubhekisela ezinqubweni ezisebenzisa ukwelashwa ngamakhemikhali, amagesi, noma izindlela ezibonakalayo ukususa ukungcola ebusweni be-wafer. Izinto ezingcolisayo njengezinhlayiya, izinsimbi, izinsalela zezinto eziphilayo, kanye nama-oxide emvelo konke kungathinta kabi ukusebenza kwedivayisi, ukuthembeka, kanye nokukhiqiza. Ukuhlanza kusebenza “njengebhuloho” phakathi kwezinyathelo zokukhiqiza ezilandelanayo—isibonelo, ngaphambi kokufakwa kanye ne-lithography, noma ngemva kokuqopha, i-CMP (ukupholisha kwamakhemikhali), kanye nokufakelwa kwama-ion. Ngokubanzi, ukuhlanza i-wafer kungahlukaniswa ngezigaba ezimbili:ukuhlanza okumanzifuthiukuhlanza okomile.

Ukuhlanza Okumanzi

Ukuhlanza ngamanzi kusebenzisa izinyibilikisi zamakhemikhali noma amanzi ahlanzekile (DIW) ukuhlanza ama-wafer. Izindlela ezimbili eziyinhloko zisetshenziswa:

• Indlela yokucwilisa: ama-wafer acwiliswa emathangini agcwele izinyibilikisi noma i-DIW. Lena yindlela esetshenziswa kakhulu, ikakhulukazi kuma-node obuchwepheshe avuthiwe.

• Indlela yokufafaza: izinyibilikisi noma i-DIW zifuthwa kuma-wafer ajikelezayo ukuze kususwe ukungcola. Nakuba ukucwiliswa kuvumela ukucutshungulwa kwenqwaba yama-wafer amaningi, ukuhlanza isifutho kuphatha i-wafer eyodwa kuphela ekamelweni ngalinye kodwa kunikeza ukulawula okungcono, okwenza kube yinto evamile kuma-node athuthukile.

Ukuhlanza Okungadingi Ugesi

Njengoba igama lisho, ukuhlanza okomile kugwema izinyibilikisi noma i-DIW, esikhundleni salokho kusebenzisa amagesi noma i-plasma ukususa ukungcola. Njengoba kuqhutshekwa kufinyelelwa kuma-node athuthukile, ukuhlanza okomile kuthola ukubaluleka ngenxa yokuthiukunemba okuphezulukanye nokusebenza kahle ngokumelene nezinto eziphilayo, ama-nitride, nama-oxide. Kodwa-ke, kudingaukutshalwa kwezimali okuphezulu kwemishini, ukusebenza okuyinkimbinkimbi kakhulu, kanye nokulawulwa kwenqubo okuqinileEnye inzuzo ukuthi ukuhlanza okomile kunciphisa inani elikhulu lamanzi angcolile akhiqizwa ngezindlela ezimanzi.

Izindlela Ezivamile Zokuhlanza Okumanzi

1. Ukuhlanza kwe-DIW (Amanzi Ahlanzekile)

I-DIW iyisihlanzi esisetshenziswa kakhulu ekuhlanzeni okumanzi. Ngokungafani namanzi angalashwanga, i-DIW ayinawo cishe ama-ion aqhubayo, okuvimbela ukugqwala, ukusabela kwe-electrochemical, noma ukuwohloka kwedivayisi. I-DIW isetshenziswa kakhulu ngezindlela ezimbili:

1. Ukuhlanza ubuso be-wafer ngqo– Ngokuvamile kwenziwa ngemodi ye-single-wafer ngama-roller, amabhulashi, noma ama-nozzle okufutha ngesikhathi sokujikeleza kwe-wafer. Inselele ukwakheka kweshaja kagesi, okungase kubangele amaphutha. Ukuze kuncishiswe lokhu, i-CO₂ (futhi ngezinye izikhathi i-NH₃) incibilikiswa ibe yi-DIW ukuze kuthuthukiswe ukuhanjiswa ngaphandle kokungcolisa i-wafer.

2. Ukuhlanza ngemva kokuhlanza ngamakhemikhali– I-DIW isusa izixazululo zokuhlanza ezisele ezingase zonakalise i-wafer noma zonakalise ukusebenza kwedivayisi uma zishiywa phezu kwayo.

2. Ukuhlanza kwe-HF (Hydrofluoric Acid)

I-HF iyikhemikhali ephumelela kakhulu ekususeniizendlalelo ze-oxide zomdabu (SiO₂)kuma-wafer e-silicon futhi ilandela i-DIW ngokubaluleka. Iphinde incibilikise izinsimbi ezinamathiselwe futhi icindezele ukushintshwa kwe-oxidation. Kodwa-ke, ukugoba kwe-HF kungalimaza izindawo ze-wafer futhi kuhlasele izinsimbi ezithile ngokungathandeki. Ukuze kuxazululwe lezi zinkinga, izindlela ezithuthukisiwe zinciphisa i-HF, zengeze ama-oxidizer, ama-surfactant, noma ama-complexing agents ukuze kuthuthukiswe ukukhetha nokunciphisa ukungcola.

3. Ukuhlanza kwe-SC1 (Ukuhlanza Okujwayelekile 1: NH₄OH + H₂O₂ + H₂O)

I-SC1 iyindlela engabizi kakhulu futhi esebenza kahle kakhulu yokususaizinsalela zezinto eziphilayo, izinhlayiya, kanye nezinye izinsimbi. Le ndlela ihlanganisa isenzo sokuxosha se-H₂O₂ kanye nomphumela wokuncibilikisa we-NH₄OH. Iphinde ixoshe izinhlayiya ngamandla kagesi, futhi usizo lwe-ultrasonic/megasonic luthuthukisa ukusebenza kahle. Kodwa-ke, i-SC1 ingalungisa izindawo ze-wafer, edinga ukulungiswa ngokucophelela kwezilinganiso zamakhemikhali, ukulawulwa kokucindezelwa kwendawo (ngama-surfactants), kanye nama-chelating agents ukucindezela ukuphinda kubekwe insimbi.

4. Ukuhlanza kwe-SC2 (Ukuhlanza Okujwayelekile 2: HCl + H₂O₂ + H₂O)

I-SC2 igcwalisa i-SC1 ngokususaizinto ezingcolisayo zensimbiAmandla ayo aqinile okuhlanganisa izinto aguqula izinsimbi ezi-oxidized zibe usawoti noma ama-complex ancibilikayo, ahlanzwa. Nakuba i-SC1 isebenza kahle ezintweni eziphilayo kanye nezinhlayiya, i-SC2 ibaluleke kakhulu ekuvimbeleni ukumuncwa kwensimbi nokuqinisekisa ukungcoliswa kwensimbi okuphansi.

5. Ukuhlanza kwe-O₃ (i-Ozone)

Ukuhlanza i-ozone kusetshenziselwa kakhuluukususa izinto eziphilayofuthiukubulala amagciwane e-DIW. I-O₃ isebenza njenge-oxidant enamandla, kodwa ingabangela ukubuyiselwa kwesimo sayo, ngakho-ke ivame ukuhlanganiswa ne-HF. Ukulungiswa kwezinga lokushisa kubalulekile njengoba ukuncibilika kwe-O₃ emanzini kwehla emazingeni okushisa aphezulu. Ngokungafani nezibulali-magciwane ezisekelwe ku-chlorine (ezingamukeleki ezindlini ze-semiconductor), i-O₃ iyabola ibe yi-oxygen ngaphandle kokungcolisa izinhlelo ze-DIW.

6. Ukuhlanzwa Kwe-Organic Solvent

Ezinqubweni ezithile ezikhethekile, kusetshenziswa izinyibilikisi eziphilayo lapho izindlela zokuhlanza ezijwayelekile zinganele noma zingafaneleki (isb., lapho ukwakheka kwe-oxide kufanele kugwenywe).

Isiphetho

Ukuhlanza ama-waferisinyathelo esiphindaphindwa njaloekukhiqizweni kwe-semiconductor futhi kuthinta ngqo umkhiqizo kanye nokuthembeka kwamadivayisi. Ngokuqhubekela phambiliama-wafer amakhulu kanye namajiyometri amancane edivayisi, izidingo zokuhlanzeka kobuso be-wafer, isimo samakhemikhali, ubulukhuni, kanye nobukhulu be-oxide ziya ngokuya ziba nzima.

Lesi sihloko sibukeze ubuchwepheshe bokuhlanza ama-wafer obuvuthiwe nobuthuthukisiwe, okuhlanganisa izindlela ze-DIW, HF, SC1, SC2, O₃, kanye nezindlela ze-organic solvent, kanye nezindlela zazo, izinzuzo, kanye nemikhawulo.imibono yezomnotho kanye nezemvelo, ukuthuthukiswa okuqhubekayo kobuchwepheshe bokuhlanza ama-wafer kubalulekile ukuze kuhlangatshezwane nezidingo zokukhiqiza ama-semiconductor athuthukile.