Enqubweni yokuthuthukiswa echumayo yemboni ye-semiconductor, ikristalu elilodwa elicwebezelisiweizingcezu ze-siliconzidlala indima ebalulekile. Zisebenza njengezinto eziyisisekelo zokukhiqizwa kwamadivayisi ahlukahlukene e-microelectronic. Kusukela kumasekethe ahlanganisiwe ayinkimbinkimbi futhi anembile kuya kuma-microprocessor asheshayo kanye nezinzwa eziningi, ikristalu elilodwa elicwebezelisiweizingcezu ze-siliconkubalulekile. Umehluko ekusebenzeni kwazo kanye nemininingwane yazo uthinta ngqo ikhwalithi kanye nokusebenza kwemikhiqizo yokugcina. Ngezansi kunemininingwane ejwayelekile kanye nemingcele yama-wafer e-silicon e-polyester acwebezelayo:

Ububanzi: Usayizi wama-wafer e-silicon angama-semiconductor single crystal ulinganiswa ngobubanzi bawo, futhi eza ngezinhlobo ezahlukene zemininingwane. Ububanzi obuvamile buhlanganisa ama-intshi angu-2 (50.8mm), ama-intshi angu-3 (76.2mm), ama-intshi angu-4 (100mm), ama-intshi angu-5 (125mm), ama-intshi angu-6 (150mm), ama-intshi angu-8 (200mm), ama-intshi angu-12 (300mm), kanye nama-intshi angu-18 (450mm). Ububanzi obuhlukene bufanelekela izidingo ezahlukene zokukhiqiza kanye nezidingo zenqubo. Isibonelo, ama-wafer amancane anobubanzi avame ukusetshenziselwa amadivayisi akhethekile, amancane e-microelectronic, kuyilapho ama-wafer amakhulu anobubanzi ebonisa ukusebenza kahle kokukhiqiza okuphezulu kanye nezinzuzo zezindleko ekukhiqizweni kwesekethe ehlanganisiwe enkulu. Izidingo zobuso zihlukaniswa njenge-single-side polished (SSP) kanye ne-double-side polished (DSP). Ama-wafer acwebezelwe ohlangothini olulodwa asetshenziselwa amadivayisi adinga ukuthamba okuphezulu ohlangothini olulodwa, njengezinzwa ezithile. Ama-wafer acwebezelwe ohlangothini olulodwa avame ukusetshenziselwa amasekethe ahlanganisiwe kanye neminye imikhiqizo edinga ukunemba okuphezulu kuzo zombili izindawo. Isidingo Somphezulu (Ukuqeda): I-SSP epholishiwe ohlangothini olulodwa / I-DSP epholishiwe ohlangothini olulodwa.

Uhlobo/I-Dopant: (1) I-Semiconductor yohlobo lwe-N: Uma ama-athomu athile okungcola ethulwa ku-semiconductor yangaphakathi, ashintsha ukuhanjiswa kwawo. Isibonelo, lapho kungezwa izinto ze-pentavalent ezifana ne-nitrogen (N), i-phosphorus (P), i-arsenic (As), noma i-antimony (Sb), ama-electron awo e-valence akha izibopho ze-covalent nama-electron e-valence ama-athomu e-silicon azungezile, okushiya i-electron eyengeziwe ingaboshiwe yisibopho se-covalent. Lokhu kuphumela ekugxilweni kwe-electron okukhulu kunokugxila kwembobo, okwakha i-semiconductor yohlobo lwe-N, eyaziwa nangokuthi i-semiconductor yohlobo lwe-electron. Ama-semiconductor ohlobo lwe-N abalulekile ekukhiqizeni amadivayisi adinga ama-electron njengabathwali abaphambili bokushaja, njengamadivayisi athile wamandla. (2) I-Semiconductor yohlobo lwe-P: Lapho izinto zokungcola ze-trivalent ezifana ne-boron (B), i-gallium (Ga), noma i-indium (In) zethulwa ku-semiconductor ye-silicon, ama-electron e-valence ama-athomu okungcola akha izibopho ze-covalent nama-athomu e-silicon azungezile, kodwa awanawo okungenani i-valence electron eyodwa futhi awakwazi ukwakha isibopho se-covalent esiphelele. Lokhu kuholela ekugxilweni kwemigodi okukhulu kune-electron concentration, okwakha i-semiconductor yohlobo lwe-P, eyaziwa nangokuthi i-semiconductor yohlobo lwemigodi. Ama-semiconductor ohlobo lwe-P adlala indima ebalulekile ekukhiqizeni amadivayisi lapho imigodi isebenza khona njengabathwali abayinhloko bokushaja, njengama-diode nama-transistors athile.

Ukumelana: Ukumelana kuyinto ebalulekile ebonakalayo elinganisa ukuhambisana kukagesi kwama-wafer e-silicon acwebezelayo acwebezelayo. Inani lawo libonisa ukusebenza kokuhambisana kwezinto. Uma ukumelana kuphansi, ukuhambisana kokuhambisana kwe-wafer ye-silicon kuba ngcono; ngokuphambene nalokho, uma ukumelana kuphakeme, ukuhambisana kokuhambisana kuba kubi kakhulu. Ukumelana kwama-wafer e-silicon kunqunywa yizakhiwo zawo ezibonakalayo, futhi izinga lokushisa nalo linomthelela omkhulu. Ngokuvamile, ukumelana kwama-wafer e-silicon kuyanda ngokushisa. Ezisetshenzisweni ezisebenzayo, amadivayisi ahlukene e-microelectronic anezidingo ezahlukene zokumelana kwama-wafer e-silicon. Isibonelo, ama-wafer asetshenziswa ekukhiqizeni isekethe ehlanganisiwe adinga ukulawulwa okuqondile kokumelana ukuqinisekisa ukusebenza kwedivayisi okuzinzile nokuthembekile.

Ukuqondiswa: Ukuqondiswa kwekristalu kwe-wafer kumelela ukuqondiswa kwekristalu kwe-lattice ye-silicon, okuvame ukucaciswa yizinkomba ze-Miller ezifana ne-(100), (110), (111), njll. Ukuqondiswa kwekristalu okuhlukile kunezakhiwo zomzimba ezihlukile, njengobuningi bomugqa, okuhlukahluka ngokusekelwe ekuqondisweni. Lo mehluko ungathinta ukusebenza kwe-wafer ezinyathelweni zokucubungula ezilandelayo kanye nokusebenza kokugcina kwamadivayisi e-microelectronic. Enqubweni yokukhiqiza, ukukhetha i-wafer ye-silicon enokuqondisa okufanele kwezidingo ezahlukene zedivayisi kungenza ngcono ukusebenza kwedivayisi, kuthuthukise ukusebenza kahle kokukhiqiza, futhi kuthuthukise ikhwalithi yomkhiqizo.

I-Flat/Notch: Unqenqema oluyisicaba (Flat) noma i-V-notch (Notch) oluzungeza i-silicon wafer ludlala indima ebalulekile ekuqondisweni kwe-crystal orientation futhi luyisihlonzi esibalulekile ekukhiqizweni nasekucutshungulweni kwe-wafer. Ama-wafer anobubanzi obuhlukene ahambisana nezindinganiso ezahlukene zobude be-Flat noma i-Notch. Imiphetho yokuqondanisa ihlukaniswe ibe yi-primary flat kanye ne-secondary flat. I-primary flat isetshenziswa kakhulu ukunquma ukuqondiswa kwe-crystal okuyisisekelo kanye nereferensi yokucubungula ye-wafer, kuyilapho i-secondary flat isiza kakhulu ekuqondisweni nasekucutshungulweni okunembile, ukuqinisekisa ukusebenza okunembile kanye nokuvumelana kwe-wafer kulo lonke umugqa wokukhiqiza.

Ubukhulu: Ubukhulu be-wafer buvame ukucaciswa ngama-micrometer (μm), kanti ubukhulu obuvamile buphakathi kuka-100μm no-1000μm. Ama-wafer anobukhulu obuhlukene afanele izinhlobo ezahlukene zamadivayisi e-microelectronic. Ama-wafer amancane (isb., 100μm – 300μm) avame ukusetshenziselwa ukukhiqizwa kwama-chip adinga ukulawulwa okuqinile kobukhulu, ukunciphisa usayizi nesisindo se-chip nokwandisa ubuningi bokuhlanganiswa. Ama-wafer amakhulu (isb., 500μm – 1000μm) asetshenziswa kabanzi kumadivayisi adinga amandla aphezulu okusebenza, njengamadivayisi e-semiconductor yamandla, ukuqinisekisa ukuzinza ngesikhathi sokusebenza.

Ubulukhuni Bomphezulu: Ubulukhuni bomphezulu bungenye yezindlela ezibalulekile zokuhlola ikhwalithi ye-wafer, njengoba ithinta ngqo ukunamathelana phakathi kwe-wafer nezinto ezalandela zefilimu encane, kanye nokusebenza kukagesi kwedivayisi. Ngokuvamile kuvezwa njengobunzima besikwele esiphakathi kwempande (RMS) (ngo-nm). Ubulukhuni bomphezulu obuphansi busho ukuthi ubuso be-wafer bubushelelezi, okusiza ukunciphisa izimo ezifana nokusabalala kwama-electron futhi kuthuthukise ukusebenza kwedivayisi kanye nokuthembeka. Ezinqubweni zokukhiqiza ze-semiconductor ezithuthukisiwe, izidingo zobulukhuni bomphezulu ziya ngokuya ziba nzima, ikakhulukazi ekukhiqizweni kwesekethe ehlanganisiwe ephezulu, lapho ubulukhuni bomphezulu kumele bulawulwe kuma-nanometer ambalwa noma ngaphansi.

Ukwehluka Kobukhulu Obuphelele (i-TTV): Ukwehluka kobukhulu obuphelele kubhekisela kumehluko phakathi kobukhulu obukhulu nobuncane obulinganiswa ezindaweni eziningi ebusweni be-wafer, obuvame ukuvezwa ku-μm. I-TTV ephezulu ingaholela ekuphambukeni ezinqubweni ezifana ne-photolithography kanye nokuqopha, okuthinta ukuhambisana nokusebenza kwedivayisi kanye nokukhiqiza. Ngakho-ke, ukulawula i-TTV ngesikhathi sokukhiqizwa kwe-wafer kuyisinyathelo esibalulekile ekuqinisekiseni ikhwalithi yomkhiqizo. Ekukhiqizweni kwamadivayisi e-microelectronic anembile kakhulu, i-TTV ngokuvamile iyadingeka ukuthi ibe ngaphakathi kwama-micrometer ambalwa.

Umnsalo: Umnsalo ubhekisela ekuphambukeni phakathi kobuso be-wafer kanye nendiza eyisicaba efanele, evame ukulinganiswa ngo-μm. Ama-wafer anokugoba ngokweqile angaphula noma abhekane nokucindezeleka okungalingani ngesikhathi sokucubungula okulandelayo, okuthinta ukusebenza kahle kokukhiqiza kanye nekhwalithi yomkhiqizo. Ikakhulukazi ezinqubweni ezidinga ukugoba okuphezulu, njenge-photolithography, ukugoba kumele kulawulwe ngaphakathi kobubanzi obuthile ukuqinisekisa ukunemba nokuvumelana kwephethini ye-photolithographic.

I-Warp: I-Warp ikhombisa ukuphambuka phakathi kobuso be-wafer kanye nesimo esiyindilinga esifanele, esilinganiswa ngama-μm. Ngokufana nomnsalo, i-warp iyisibonakaliso esibalulekile sokuthamba kwe-wafer. I-warp eningi ayithinti nje kuphela ukunemba kokubekwa kwe-wafer emishinini yokucubungula kodwa ingabangela nezinkinga ngesikhathi senqubo yokupakisha ama-chip, njengokubopha okungekuhle phakathi kwe-chip nezinto zokupakisha, okuthinta nokuthembeka kwedivayisi. Ekukhiqizweni kwe-semiconductor ephezulu, izidingo ze-warp ziya ngokuya ziba nzima ukuhlangabezana nezidingo zezinqubo zokukhiqiza ama-chip ezithuthukisiwe kanye nokupakisha.

Iphrofayili Yomphetho: Iphrofayili yomphetho we-wafer ibalulekile ekucutshungulweni nasekuphathweni kwayo okulandelayo. Ngokuvamile ichazwa yi-Edge Exclusion Zone (EEZ), echaza ibanga ukusuka kumphetho we-wafer lapho kungavunyelwe khona ukucubungula. Iphrofayili yomphetho eklanywe kahle kanye nokulawula okunembile kwe-EEZ kusiza ukugwema amaphutha omphetho, ukugxila kokucindezeleka, nezinye izinkinga ngesikhathi sokucubungula, okuthuthukisa ikhwalithi kanye nesivuno se-wafer iyonke. Kwezinye izinqubo zokukhiqiza ezithuthukisiwe, ukunemba kwephrofayili yomphetho kuyadingeka ukuthi kube sezingeni le-sub-micron.

Ukubalwa Kwezinhlayiya: Inani kanye nokusatshalaliswa kwezinhlayiya ebusweni be-wafer kuthinta kakhulu ukusebenza kwamadivayisi e-microelectronic. Izinhlayiya eziningi noma ezinkulu zingaholela ekuhlulekeni kwedivayisi, njengemijikelezo emifushane noma ukuvuza, okunciphisa isivuno somkhiqizo. Ngakho-ke, inani lezinhlayiya livame ukulinganiswa ngokubala izinhlayiya endaweni ngayinye, njengenani lezinhlayiya ezinkulu kuno-0.3μm. Ukulawulwa okuqinile kokubalwa kwezinhlayiya ngesikhathi sokukhiqizwa kwe-wafer kuyisilinganiso esibalulekile sokuqinisekisa ikhwalithi yomkhiqizo. Ubuchwepheshe bokuhlanza obuthuthukisiwe kanye nendawo yokukhiqiza ehlanzekile kusetshenziswa ukunciphisa ukungcoliswa kwezinhlayiya ebusweni be-wafer.

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