Ukuhlanza ngamanzi (Wet Clean) kungenye yezinyathelo ezibalulekile ezinqubweni zokukhiqiza ama-semiconductor, okuhloswe ngazo ukususa ukungcola okuhlukahlukene ebusweni be-wafer ukuqinisekisa ukuthi izinyathelo zenqubo ezilandelayo zingenziwa endaweni ehlanzekile.
Njengoba ubukhulu bamadivayisi e-semiconductor buqhubeka nokuncipha futhi izidingo zokunemba zanda, izidingo zobuchwepheshe zezinqubo zokuhlanza i-wafer ziye zaba nzima kakhulu. Ngisho nezinhlayiya ezincane kakhulu, izinto eziphilayo, ama-ion ensimbi, noma izinsalela ze-oxide ebusweni be-wafer zingathinta kakhulu ukusebenza kwedivayisi, ngaleyo ndlela zithinte ukukhiqizwa nokuthembeka kwamadivayisi e-semiconductor.
Izimiso Eziyinhloko Zokuhlanza I-Wafer
Ingqikithi yokuhlanza i-wafer iwukususa ngempumelelo ukungcola okuhlukahlukene ebusweni be-wafer ngezindlela ezibonakalayo, zamakhemikhali, kanye nezinye ukuqinisekisa ukuthi i-wafer inobuso obuhlanzekile obufanele ukucutshungulwa okulandelayo.
Uhlobo Lokungcola
Amathonya Amakhulu Ezicini Zedivayisi
| ukungcola kwesihloko | Amaphutha ephethini
Amaphutha okufakelwa kwe-ion
Amaphutha okuqhekeka kwefilimu yokuvikela
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| Ukungcola Kwensimbi | Izinsimbi ze-Alkali | Ukungazinzi kwe-transistor ye-MOS
Ukuwohloka/ukubola kwefilimu ye-okside yesango
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| Izinsimbi Ezisindayo | Ukwanda komugqa wokuvuza obuyela emuva we-PN junction
Amaphutha okuqhekeka kwefilimu ye-okside yesango
Ukuwohloka kwesikhathi sokuphila kwenkampani encane
Ukukhiqizwa kwesici sokwehliswa kwengqimba ye-oxide
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| Ukungcola Kwamakhemikhali | Izinto Eziphilayo | Amaphutha okuqhekeka kwefilimu ye-okside yesango
Izinguquko zefilimu ye-CVD (izikhathi zokufukamela)
Ukwehluka kobukhulu befilimu ye-thermal oxide (i-oxidation esheshisiwe)
Ukwenzeka komswakama (i-wafer, ilensi, isibuko, imaski, i-reticle)
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| Ama-Dopants Angaphili (B, P) | I-MOS transistor Vth iyashintsha
Izinhlobo zokumelana ne-substrate kanye nokumelana okuphezulu kweshidi le-poly-silicon
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| Izisekelo Ezingaphili (ama-amine, i-ammonia) kanye nama-Acids (SOx) | Ukuwohloka kokuxazululwa kwezindlela zokumelana ezikhuliswe ngamakhemikhali
Ukuvela kokungcoliswa kwezinhlayiya kanye nomswakama ngenxa yokukhiqizwa kukasawoti
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| Amafilimu e-Oxide emvelo namakhemikhali ngenxa yomswakama, umoya | Ukumelana nokuxhumana okwandisiwe
Ukuwohloka/ukubola kwefilimu ye-okside yesango
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Ngokuqondile, izinhloso zenqubo yokuhlanza i-wafer zifaka:
Ukususwa Kwezinhlayiya: Ukusebenzisa izindlela zomzimba noma zamakhemikhali ukususa izinhlayiya ezincane ezinamathele ebusweni be-wafer. Izinhlayiya ezincane kunzima kakhulu ukuzisusa ngenxa yamandla aqinile kagesi aphakathi kwazo nobuso be-wafer, okudinga ukwelashwa okukhethekile.
Ukususwa Kwezinto Eziphilayo: Izinto ezingcolisayo eziphilayo ezifana namafutha kanye nezinsalela ze-photoresist zinganamathela ebusweni be-wafer. Lezi zinto ezingcolisayo zivame ukususwa kusetshenziswa ama-oxidizing agents anamandla noma izinyibilikisi.
Ukususwa kwe-Ion Yensimbi: Izinsalela ze-ion yensimbi ebusweni be-wafer zingonakalisa ukusebenza kukagesi futhi zithinte ngisho nezinyathelo zokucubungula ezilandelayo. Ngakho-ke, kusetshenziswa izixazululo ezithile zamakhemikhali ukususa lawa ma-ion.
Ukususwa kwe-Oxide: Ezinye izinqubo zidinga ukuthi indawo ye-wafer ingabi nezingxenye ze-oxide, njenge-silicon oxide. Ezimweni ezinjalo, izingxenye zemvelo ze-oxide zidinga ukususwa ngesikhathi sezinyathelo ezithile zokuhlanza.
Inselele yobuchwepheshe bokuhlanza i-wafer isekususeni ngempumelelo izinto ezingcolisayo ngaphandle kokuthinta kabi ubuso be-wafer, njengokuvimbela ukugqwala, ukugqwala, noma omunye umonakalo ongokwenyama.
2. Ukugeleza Kwenqubo Yokuhlanza I-Wafer
Inqubo yokuhlanza i-wafer ngokuvamile ihilela izinyathelo eziningi ukuqinisekisa ukususwa okuphelele kwezinto ezingcolisayo nokufeza indawo ehlanzekile ngokuphelele.
Umfanekiso: Ukuqhathanisa Phakathi Kokuhlanza Uhlobo Lweqembu kanye Nokuhlanza Kwe-Single-Wafer
Inqubo evamile yokuhlanza i-wafer ihlanganisa izinyathelo ezilandelayo eziyinhloko:
1. Ukuhlanza Ngaphambi Kokuhlanza (Ukuhlanza Ngaphambi Kokuhlanza)
Inhloso yokuhlanza kusengaphambili ukususa ukungcola okuxekethile kanye nezinhlayiya ezinkulu ebusweni be-wafer, okuvame ukufezwa ngokuhlanzwa ngamanzi acwebezelwe (i-DI Water) kanye nokuhlanza nge-ultrasonic. Amanzi acwebezelwe angasusa izinhlayiya kanye nokungcola okuncibilikisiwe ebusweni be-wafer, kuyilapho ukuhlanza nge-ultrasonic kusebenzisa imiphumela ye-cavitation ukuphula isibopho phakathi kwezinhlayiya kanye nobuso be-wafer, okwenza kube lula ukuzikhipha.
2. Ukuhlanza Amakhemikhali
Ukuhlanza ngamakhemikhali kungenye yezinyathelo eziyinhloko enkambisweni yokuhlanza i-wafer, kusetshenziswa izixazululo zamakhemikhali ukususa izinto eziphilayo, ama-ion ensimbi, nama-oxide ebusweni be-wafer.
Ukususwa Kwezinto Eziphilayo: Ngokuvamile, i-acetone noma ingxube ye-ammonia/peroxide (SC-1) isetshenziselwa ukuncibilikisa nokuxova ukungcola okungokwemvelo. Isilinganiso esijwayelekile sesisombululo se-SC-1 yi-NH₄OH
₂O₂
₂O = 1:1:5, kanye nokushisa okusebenzayo okungaba ngu-20°C.
Ukususwa kwe-Metal Ion: Izingxube ze-nitric acid noma i-hydrochloric acid/peroxide (SC-2) zisetshenziselwa ukususa ama-ion ensimbi ebusweni be-wafer. Isilinganiso esijwayelekile sesisombululo se-SC-2 yi-HCl
₂O₂
₂O = 1:1:6, izinga lokushisa ligcinwa cishe ku-80°C.
Ukususwa kwe-Oxide: Kwezinye izinqubo, kudingeka ukususwa kwengqimba ye-oxide yemvelo ebusweni be-wafer, lapho kusetshenziswa khona isisombululo se-hydrofluoric acid (HF). Isilinganiso esijwayelekile sesisombululo se-HF yi-HF
₂O = 1:50, futhi ingasetshenziswa ekushiseni kwegumbi.
3. Ukuhlanza Kokugcina
Ngemva kokuhlanza ngamakhemikhali, ama-wafer avame ukuthatha isinyathelo sokugcina sokuhlanza ukuqinisekisa ukuthi akukho zinsalela zamakhemikhali ezisele phezu kobuso. Ukuhlanza kokugcina kusebenzisa amanzi ahlanzekile ukuze kuhlanjululwe kahle. Ngaphezu kwalokho, ukuhlanza ngamanzi e-ozone (O₃/H₂O) kusetshenziselwa ukususa noma yikuphi ukungcola okusele ebusweni be-wafer.
4. Ukomisa
Ama-wafer ahlanziwe kumele omiswe ngokushesha ukuze kuvinjelwe ama-watermark noma ukunamathiselwa kabusha kokungcola. Izindlela ezivamile zokomisa zifaka phakathi ukomisa nge-spin kanye nokuhlanza nge-nitrogen. Eyokuqala isusa umswakama ebusweni be-wafer ngokuyijikeleza ngesivinini esikhulu, kanti eyesibili iqinisekisa ukoma okuphelele ngokufutha igesi ye-nitrogen eyomile phezu kobuso be-wafer.
Isingcolisi
Igama Lenqubo Yokuhlanza
Incazelo Yengxube Yamakhemikhali
Amakhemikhali
| Izinhlayiya | I-Piranha (SPM) | I-asidi ye-sulfuric/i-hydrogen peroxide/amanzi e-DI | H2SO4/H2O2/H2O 3-4:1; 90°C |
| I-SC-1 (i-APM) | I-Ammonium hydroxide/i-hydrogen peroxide/amanzi e-DI | 80°C; NH4OH/H2O2/H2O 1:4:20 | |
| Izinsimbi (hhayi ithusi) | I-SC-2 (i-HPM) | I-Hydrochloric acid/i-hydrogen peroxide/amanzi e-DI | HCl/H2O2/H2O1:1:6; 85°C |
| I-Piranha (SPM) | I-asidi ye-sulfuric/i-hydrogen peroxide/amanzi e-DI | H2SO4/H2O2/H2O3-4:1; 90°C | |
| I-DHF | Nciphisa amanzi e-hydrofluoric acid/DI (ngeke kususe ithusi) | HF/H2O1:50 | |
| Izinto eziphilayo | I-Piranha (SPM) | I-asidi ye-sulfuric/i-hydrogen peroxide/amanzi e-DI | H2SO4/H2O2/H2O 3-4:1; 90°C |
| I-SC-1 (i-APM) | I-Ammonium hydroxide/i-hydrogen peroxide/amanzi e-DI | 80°C; NH4OH/H2O2/H2O 1:4:20 | |
| I-DIO3 | I-ozone emanzini akhishwe i-ion | Izingxube Ezilungiselelwe ze-O3/H2O | |
| I-Oxide Yomdabu | I-DHF | Nciphisa i-hydrofluoric acid/i-DI water | HF/H2O 1:100 |
| I-BHF | I-asidi ye-hydrofluoric ehlanganisiwe | I-NH4F/HF/H2O |
3. Izindlela Zokuhlanza Ezivamile Ze-Wafer
1. Indlela Yokuhlanza ye-RCA
Indlela yokuhlanza i-RCA ingenye yezindlela zokuhlanza i-wafer ezidumile kakhulu embonini ye-semiconductor, eyasungulwa yi-RCA Corporation eminyakeni engaphezu kwengu-40 eyedlule. Le ndlela isetshenziswa kakhulu ukususa ukungcola okungokwemvelo kanye nokungcola kwe-ion yensimbi futhi ingaqedwa ngezinyathelo ezimbili: i-SC-1 (Standard Clean 1) kanye ne-SC-2 (Standard Clean 2).
Ukuhlanza kwe-SC-1: Lesi sinyathelo sisetshenziswa kakhulu ukususa ukungcola kanye nezinhlayiya eziphilayo. Isixazululo siyingxube ye-ammonia, i-hydrogen peroxide, namanzi, okwakha ungqimba oluncane lwe-silicon oxide ebusweni be-wafer.
Ukuhlanza kwe-SC-2: Lesi sinyathelo sisetshenziswa kakhulu ukususa ukungcola kwe-ion yensimbi, kusetshenziswa ingxube ye-hydrochloric acid, i-hydrogen peroxide, namanzi. Sishiya ungqimba oluncane lokudlula phezu kwe-wafer ukuvimbela ukungcola.
2. Indlela Yokuhlanza I-Piranha (Ukuhlanza I-Piranha Etch)
Indlela yokuhlanza iPiranha iyindlela ephumelela kakhulu yokususa izinto eziphilayo, kusetshenziswa ingxube ye-sulfuric acid ne-hydrogen peroxide, ngokuvamile ngesilinganiso esingu-3:1 noma 4:1. Ngenxa yezakhiwo ezinamandla kakhulu ze-oxidative zalesi sixazululo, ingasusa inani elikhulu lezinto eziphilayo kanye nokungcola okuqinile. Le ndlela idinga ukulawulwa okuqinile kwezimo, ikakhulukazi maqondana nokushisa kanye nokuhlushwa, ukuze kugwenywe ukulimaza i-wafer.
Ukuhlanzwa kwe-Ultrasonic kusebenzisa umphumela we-cavitation okhiqizwa amaza omsindo aphindaphindwayo kuketshezi ukususa ukungcola ebusweni be-wafer. Uma kuqhathaniswa nokuhlanzwa kwe-ultrasonic okuvamile, ukuhlanzwa kwe-megasonic kusebenza ngesivinini esiphezulu, okuvumela ukususwa okuphumelelayo kwezinhlayiya ezincane ngobukhulu ngaphandle kokulimaza ubuso be-wafer.
4. Ukuhlanzwa kwe-Ozone
Ubuchwepheshe bokuhlanza i-ozone busebenzisa izakhiwo ezinamandla zokuxova i-ozone ukuze zibole futhi zisuse ukungcola okungokwemvelo ebusweni be-wafer, ekugcineni kuziguqule zibe yi-carbon dioxide namanzi angenangozi. Le ndlela ayidingi ukusetshenziswa kwama-reagent amakhemikhali abizayo futhi ibangela ukungcola okuncane kwemvelo, okwenza kube ubuchwepheshe obusha emkhakheni wokuhlanza i-wafer.
4. Imishini Yokuhlanza I-Wafer
Ukuqinisekisa ukusebenza kahle nokuphepha kwezinqubo zokuhlanza i-wafer, kusetshenziswa imishini yokuhlanza esezingeni eliphezulu ehlukahlukene ekukhiqizweni kwe-semiconductor. Izinhlobo eziyinhloko zifaka:
1. Imishini Yokuhlanza Emanzi
Imishini yokuhlanza ngamanzi ihlanganisa amathangi ahlukahlukene okucwilisa, amathangi okuhlanza e-ultrasonic, kanye nemishini yokomisa i-spin. Lawa madivayisi ahlanganisa amandla emishini kanye nama-reagent amakhemikhali ukususa ukungcola ebusweni be-wafer. Amathangi okucwilisa ngokuvamile afakwe izinhlelo zokulawula izinga lokushisa ukuqinisekisa ukuzinza nokusebenza kahle kwezixazululo zamakhemikhali.
2. Imishini Yokuhlanza Izinto Zokomisa
Imishini yokuhlanza eyomile ihlanganisa kakhulu izihlanzi ze-plasma, ezisebenzisa izinhlayiya ezinamandla aphezulu ku-plasma ukuze zisabela futhi zisuse izinsalela ebusweni be-wafer. Ukuhlanzwa kwe-plasma kufaneleka kakhulu ezinqubweni ezidinga ukugcinwa kobuqotho bomphezulu ngaphandle kokufaka izinsalela zamakhemikhali.
3. Izinhlelo Zokuhlanza Ezizenzakalelayo
Njengoba kuqhubeka nokwanda kokukhiqizwa kwe-semiconductor, izinhlelo zokuhlanza ezenzakalelayo sezibe yindlela ekhethwayo yokuhlanza i-wafer enkulu. Lezi zinhlelo zivame ukufaka izindlela zokudlulisa ezenzakalelayo, izinhlelo zokuhlanza ezinamathangi amaningi, kanye nezinhlelo zokulawula ngokunemba ukuqinisekisa imiphumela yokuhlanza eqhubekayo ye-wafer ngayinye.
5. Izitayela Zesikhathi Esizayo
Njengoba amadivayisi e-semiconductor eqhubeka nokuncipha, ubuchwepheshe bokuhlanza i-wafer buyashintsha bubheke ezixazululweni ezisebenza kahle nezinobungani nemvelo. Ubuchwepheshe bokuhlanza besikhathi esizayo buzogxila kulokhu:
Ukususwa Kwezinhlayiya Ezingaphansi Kwe-nanometer: Ubuchwepheshe bokuhlanza obukhona bungaphatha izinhlayiya zesikali se-nanometer, kodwa ngokunciphisa okwengeziwe kosayizi wedivayisi, ukususa izinhlayiya ezingaphansi kwe-nanometer kuzoba yinselele entsha.
Ukuhlanza Okuluhlaza Nobungani Nemvelo: Ukunciphisa ukusetshenziswa kwamakhemikhali ayingozi emvelweni nokuthuthukisa izindlela zokuhlanza ezinobungani nemvelo, njengokuhlanza i-ozone kanye nokuhlanza okukhulu, kuzoba yinto ebaluleke kakhulu.
Amazinga Aphakeme Okusebenza Ngokuzenzakalelayo Nobuhlakani: Izinhlelo ezihlakaniphile zizokwenza kube lula ukuqapha nokulungisa amapharamitha ahlukahlukene ngesikhathi sangempela ngesikhathi senqubo yokuhlanza, okuzothuthukisa kakhulu ukusebenza kahle kokuhlanza kanye nokusebenza kahle kokukhiqiza.
Ubuchwepheshe bokuhlanza ama-wafer, njengesinyathelo esibalulekile ekukhiqizweni kwama-semiconductor, budlala indima ebalulekile ekuqinisekiseni ukuthi izindawo zama-wafer zihlanzekile zezinqubo ezilandelayo. Ukuhlanganiswa kwezindlela ezahlukene zokuhlanza kususa ngempumelelo ukungcola, kuhlinzeke indawo ehlanzekile ye-substrate yezinyathelo ezilandelayo. Njengoba ubuchwepheshe buthuthuka, izinqubo zokuhlanza zizoqhubeka nokulungiswa ukuze kuhlangatshezwane nezidingo zokunemba okuphezulu kanye namazinga aphansi okukhubazeka ekukhiqizweni kwama-semiconductor.
Isikhathi sokuthunyelwe: Okthoba-08-2024