Kuyini i-TGV?
I-TGV, (Nge-Glass nge), ubuchwepheshe bokudala imigodi edlulayo endaweni engaphansi kwengilazi, Kalula nje, i-TGV iyisakhiwo esiphakeme esishaya, sigcwalise futhi sixhumanise phezulu naphansi kwengilazi ukuze sakhe amasekethe ahlanganisiwe phansi kwengilazi. Lobu buchwepheshe bubhekwa njengobuchwepheshe obuyisihluthulelo sesizukulwane esilandelayo sokupakisha kwe-3D.
Yiziphi izici ze-TGV?
1. Isakhiwo: I-TGV iyisiginali esingena siqonde ngqo esidlula emgodini owenziwe phezu kwengilazi. Ngokubeka ungqimba lwensimbi oluhambisayo odongeni lwembobo, izendlalelo ezingaphezulu nezingezansi zezimpawu zikagesi ziyaxhunywa.
2. Inqubo yokukhiqiza: Ukukhiqizwa kwe-TGV kuhlanganisa ukwelashwa kwangaphambili kwe-substrate, ukwenza imigodi, ukufakwa kwezingqimba zensimbi, ukugcwaliswa kwemigodi kanye nezinyathelo zokuyithamba. Izindlela zokukhiqiza ezivamile ukuqopha ngamakhemikhali, ukubhoboza nge-laser, ukuplata nge-electroplating njalo njalo.
3. Izinzuzo zokusetshenziswa: Uma kuqhathaniswa nensimbi yendabuko edlula emgodini, i-TGV inezinzuzo zobukhulu obuncane, ukuminyana kwezintambo okuphezulu, ukusebenza okungcono kokushabalalisa ukushisa nokunye. Isetshenziswa kabanzi kuma-microelectronics, ama-optoelectronics, ama-MEMS nakwamanye amasimu okuxhumana okuphezulu.
4. Umkhuba Wokuthuthukiswa: Njengoba imikhiqizo ye-elekthronikhi ithuthukiswa ukuze incishiswe futhi ihlanganiswe kahle, ubuchwepheshe be-TGV buthola ukunakwa nokusetshenziswa okwengeziwe. Esikhathini esizayo, inqubo yayo yokukhiqiza izoqhubeka nokuthuthukiswa, futhi usayizi wayo kanye nokusebenza kwayo kuzoqhubeka nokuthuthuka.
Iyini inqubo ye-TGV:
1. Ukulungiswa kwe-substrate yengilazi (a): Lungisa i-substrate yengilazi ekuqaleni ukuqinisekisa ukuthi ubuso bayo bubushelelezi futhi buhlanzekile.
2. Ukubhoboza ngengilazi (b): I-laser isetshenziselwa ukwakha imbobo yokungena engxenyeni yengilazi. Ukuma kwembobo ngokuvamile kuyindilinga, futhi ngemva kokwelashwa nge-laser kolunye uhlangothi, iyaphendulwa bese icutshungulwa kolunye uhlangothi.
3. Ukwenziwa kwensimbi odongeni lwembobo (c): Ukwenziwa kwensimbi kwenziwa odongeni lwembobo, ngokuvamile nge-PVD, i-CVD nezinye izinqubo zokwakha ungqimba lwembewu yensimbi eqhubayo odongeni lwembobo, njenge-Ti/Cu, i-Cr/Cu, njll.
4. I-Lithography (d): Ubuso be-substrate yengilazi bumbozwe nge-photoresist kanye ne-photopattern. Veza izingxenye ezingadingi i-plating, ukuze kube yizingxenye ezidinga i-plating kuphela ezivezwayo.
5. Ukugcwaliswa kwemigodi (e): Ukufaka ithusi nge-electroplate ukuze kugcwaliswe ingilazi ngemigodi ukuze kwakheke indlela ephelele yokuhambisa umoya. Ngokuvamile kuyadingeka ukuthi imbobo igcwaliswe ngokuphelele ngaphandle kwemigodi. Qaphela ukuthi i-Cu kumdwebo ayigcwele ngokugcwele.
6. Ubuso obuyisicaba be-substrate (f): Ezinye izinqubo ze-TGV zizosicaba ubuso be-substrate yengilazi egcwele ukuqinisekisa ukuthi ubuso be-substrate bubushelelezi, okuhambisana nezinyathelo zenqubo ezilandelayo.
7. Isendlalelo sokuvikela kanye nokuxhumeka kwesiphetho (g): Isendlalelo sokuvikela (njenge-polyimide) sakhiwa phezu kwesisekelo sengilazi.
Ngamafuphi, isinyathelo ngasinye senqubo ye-TGV sibalulekile futhi sidinga ukulawulwa okunembile kanye nokwenza ngcono. Okwamanje sinikeza ubuchwepheshe be-TGV glass through hole uma kudingeka. Sicela uzizwe ukhululekile ukuxhumana nathi!
(Ulwazi olungenhla luvela ku-inthanethi, luvimbela)
Isikhathi sokuthunyelwe: Juni-25-2024